1, the product uses:
Requirements are generally used as a flexible, rigid and rigid-flexible printed circuit board manufacturing process, from the type of use required.
2, the product features:
SE from the film as anti-high-temperature processing of special additive-free silicon surface coating process, eliminate the silicone oil residue pollution problems, to provide customers with high-quality environmentally friendly products. The product is tasteless and low pollution of the FPC, small dimensional change rate at high temperatures, with excellent dimensional stability, there are single-sided release film in two sizes, the use of lamination in the rear surface does not form residue, its flexibility and The characteristics apply rigid circuit board production design and manufacturing applications occasions; SE film surface smooth and clean, no wrinkle, tear, particles, bubbles pinholes and foreign materials, have excellent mechanical properties, thickness tolerances, surface roughness is good, Pressure timely dimensional stability and other characteristics; it does not produce a gas containing chlorine, fluorine and other halogens when burned.
Heat recession: SE from thin-film thermal stability limits for both temperature and time functions. Under the joint action when both properties of the film will take place outside the heat of recession. In general, to more than 190 ℃ film heat recession it will be quite fast, so hot isolated from the application of the relevant type thin film of limited disposable best results.
3, storage
SE film stored below 50 ℃ dry clean stock room, not near the fire source, heat
Or direct sunlight. From storage for one year from the date of shipment.
