1.Usage
Suitable for fine multilayer PCB/ FPC use.
2.Introduction
a) the multi-layer structure, high-grade paper laminated together with a phenolic resin glue;
b) high-precision, non-hierarchical or off;
c) reduce the burr when drilling;
d)surface formation, avoid warpage due to climate change;
3.Storage
a) a relative humidity of 80% or less, at less 28℃ temperature;
b) stretch the whole cover, is not directly exposed to the air, to cut off contact with moisture and the board;
c) the height of each pallet should be no more than 3 levels;
d) when in wet weather, if open stretch film, try to use it up within 24 hours, in order to prevent deformation of
the absorbent sheet.
