1.Usage
Phenolic resin and wood pulp paper are mixed with and laminated together with other raw fibers materials.
Suitable for fine multilayer PCB/ FPC use.
2.Introduction
a) low cost with a widely use;
b) good dimensional stability, thickness uniformity;
c) moderate hardness reduce the burr when drilling;
d) less resin ingredient content or other impurities.
e) surface formation, avoid warpage due to climate change;
3.Storage
a) a relative humidity of 80% or less, at less 28℃ temperature;
b) stretch the whole cover, is not directly exposed to the air, to cut off contact with moisture and the board;
c) the height of each pallet should be no more than 3 levels;
d) when in wet weather, if open stretch film, try to use it up within 48 hours, in order to prevent deformation of
the absorbent sheet.
