1, use:
HAL process is mainly used to protect the non-stick tin Goldfinger and requires a high temperature glue can not afford not hierarchical.
2, features:
1, excellent high-temperature dimensional stability, with flame resistance;
2, adhesive and substrate temperature can not tear off adhesive residue, continuous high temperature operating environment (250 ℃ * 6sec);
3, creeping posted good, do not tear off adhesive residue, no bleeding.
3, storage conditions:
Frozen storage memory, temperature 22 ± 2 ℃, Humidity: 65 ~ 70RH;
Store in a cool, well-ventilated place, avoid direct sunlight.;
Validity: One year.
