1, products for way:
After heating to soften the transparent film covering the entire stack of circuit boards, enable the vacuum suction, the membrane attached to the board surface molded and paste in the bubble pad, wires and other widely used in printed circuit boards in the electronic components for export packaging.
2, forming an antistatic layer
In the PE film was added antistatic agent, in the packaging molding anti-static agent is released at high temperatures thin layer of the surface protective layer through which the protective layer of the packaging film surface resistance impedance reach 106 ~ 10 Ω. So.
3, storage
Storage: under normal temperature and humidity storage. Not direct exposure, to prevent reduced service life.
