1, use:
Copper oxide high copper as raw material, using the most advanced technology and advanced equipment, combined with rigorous process processed into the reaction may occur rapidly with the plating bath of hydrogen ion plating, copper ions supplement consumption, and because the copper oxidation product of impurity elements in ultra-low, increase the ductility of copper plating, so the plating out of the product can achieve the best quality.
2, features:
1. Ultra-fine-grained and rapid dissolution of the characteristic: Within 25 seconds, the fastest of up to 15 seconds; stability required to maintain the copper ion concentration in the bath, the product coating uniformity, stable performance.
2. The chloride ion content is low,, it will give bath stability is controlled within the optimum parameters.
3. High-purity, low impurity. Zinc, iron, nickel, lead and trace element content control and stability, to meet customer requirements. At the same time extend the life cycle of the bath, avoid copper layer black, off, or board edge copper, copper particles and other defects, to achieve the best quality and the effect of copper, while reducing brightener consumption, lower production costs.
3, storage conditions
Save room temperature, placed in ventilated place.
